| Application Method |
Dispense System |
| Applications |
Die Attach |
| Color |
Gray |
| Cure Type |
Heat Cure |
| Extractable Ionic Content, Chloride (CI-) |
30.0 ppm |
| Extractable Ionic Content, Potassium (K+) |
5.0 ppm |
| Extractable Ionic Content, Sodium (Na+) |
5.0 ppm |
| Key Characteristics |
Conductivity: Electrically Conductive, Modulus: High Modulus |
| Number of Components |
1 Part |
| Physical Form |
Paste |
| Substrates |
LeadFrame: Gold, LeadFrame: Silver |
| Technology |
Epoxy |
| Tensile Modulus, @ 250.0 °C |
720.0 N/mm² (105000.0 psi ) |
| Thixotropic Index |
4.8 |