LOCTITE ABLESTIK 2907

LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components where hot soldering is impractical.

• Electrically conductive
• Thermally conductive
• Solvent-free
• Medium viscosity

Cure Schedule, Recommended @ 25.0 °C	24.0 hr.
Cure Type	Heat Cure
Number of Components	2 Part
Shear Strength, Aluminum	1200.0 psi
Storage Temperature	27.0 °C
Substrates	Ceramic
Technology	Epoxy
Thixotropic Index	3.5
Mixed
Viscosity CP52, Mixed Speed 10 rpm	6500.0 mPa·s (cP)