LOCTITE ABLESTIK 958-8C

LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed circuit board surfaces

• Electrically conductive
• Stress absorbing
• Pb-free alternative to solder

Applications	Die Attach
Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Number of Components	1 Part
Shear Strength, Aluminum	2150.0 psi
Storage Temperature	-40.0 °C
Technology	Epoxy
Thixotropic Index	4.1
Viscosity, Cone & Plate, @ 25.0 °C	22000.0 mPa·s (cP)
Volume Resistivity	0.005 Ohm cm