LOCTITE ABLESTIK C 990 333

LOCTITE ABLESTIK C 990 333, Epoxy, Die attach LOCTITE® ABLESTIK C 990 333 silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.

• Silver-filled
• Electrically conductive
• Easily applied by stamping process
• Low extractable ionics

Applications	Die Attach
Cure Type	Heat Cure
Number of Components	1 Part
Storage Temperature	-25.0 - -18.0 °C
Technology	Epoxy
Viscosity, @ 25.0 °C	24000.0 mPa·s (cP)