LOCTITE ABLESTIK ME 990

LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required.

• One component
• Oxide filled
• Low levels of ionic contaminants

Applications	Encapsulating
Cure Schedule, @ 165.0 °C	1.0 hr.
Cure Type	Heat Cure
Number of Components	1 Part
Operating Temperature	-40.0 - 125.0 °C
Technology	Epoxy
Viscosity, Brookfield, ASTM D2393	50000.0 mPa·s (cP)