LOCTITE ECCOBOND EN 3839

LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top LOCTITE® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing.

• Provides physical and electrical protection and stable electronic performance in temperature/humidity/bias testing
• UV/ heat curable
• Flexible, low Tg material for encapsulating components on a circuit board
• Thixotropic

Applications	Encapsulating
Coefficient of Thermal Expansion (CTE), Above Tg	211.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	108.0 ppm/°C
Color	Light Blue
Cure Schedule Light Intensity	2000.0 mJ/cm²
Cure Schedule, @ 130.0 °C	10.0 min.
Cure Type	UV Cure
Glass Transition Temperature (Tg)	26.0 °C
Shelf Life	180.0 day
Shore Hardness, Shore D	27.0
Storage Modulus, DMA @ 25.0 °C	334.0 N/mm² (48400.0 psi )
Storage Temperature	-20.0 °C
Technology	Acrylic
Thixotropic Index	4.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	7800.0 mPa·s (cP)