LOCTITE ABLESTIK 517

LOCTITE ABLESTIK 517, Epoxy Film, Assembly LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages.

• Non-conductive
• Tack-free
• Low temperature cure

Adhesive Film Thickness	3.0 µm
Carrier Film Thickness	1.0 mil
Carrier Type	Glass fabric
Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	4.3
Glass Transition Temperature (Tg)	101.0 °C
Physical Form	Film
Shear Strength, Aluminum	2500.0 psi
Technology	Epoxy
Thermal Conductivity	0.28 W/mK