LOCTITE ABLESTIK 566K Így ismerik: Ablestik ABLEFILM 566K

LOCTITE ABLESTIK 566K, Epoxy Film, Assembly LOCTITE® ABLESTIK 566K is designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. This material is a low temperature cure version of LOCTITE ABLESTIK 561K adhesive.

• Extremely flexible
• Electrically Insulating
• Thermally conductive
• Low temperature cure

Cure Schedule, @ 100.0 °C	3.0 hr.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	6.1
Glass Transition Temperature (Tg)	93.0 °C
Physical Form	Film
Shear Strength, Aluminum	2200.0 psi
Technology	Epoxy
Thermal Conductivity	0.8 W/mK