LOCTITE ABLESTIK 8008 Így ismerik: ABLECOAT 8008

LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.

• Electrically conductive
• Snap curable after B-stage
• Thermally conductive
• Low modulus

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	42.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	4.0 ppm
Extractable Ionic Content, Sodium (Na+)	4.0 ppm
Hot Die Shear Strength	2.6 kg-f
RT Die Shear Strength	6.0 kg-f
Tensile Modulus, @ 250.0 °C	1800.0 N/mm² (261070.0 psi )