LOCTITE ABLESTIK 8200TI

LOCTITE ABLESTIK 8200TI, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200TI electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.

• High electrical conductivity
• Oven Curable
• Excellent adhesion to Ni/Pd/Au
• Snap curable

Applications	Die Attach
Color	Silver
Cure Schedule, @ 175.0 °C 30 min. ramp	45.0 min.
Cure Type	Heat Cure
Hot Die Shear Strength	6.0 kg-f
Thixotropic Index	5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	8800.0 mPa·s (cP)