BERGQUIST GAP PAD TGP 2000SF Így ismerik: Gap Pad® 2000SF

BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.

• High Thermal Conductivity: 2 W/m-K
• Natural inherent tack reduces interfacial thermal resistance and aids assembly
• Fiberglass reinforced for puncture, shear and tear resistance
• Conforms to demanding contours and maintains structural integrity with little stress applied to fragile component leads

Carrier Type	Fiberglass
Color	Green
Operating Temperature	-60.0 - 125.0 °C
Standard Thickness	0.254 - 3.175 mm
Technology	Silicone
Thermal Conductivity	2.0 W/mK
Young's Modulus, ASTM D575	228.0 KPa (33.0 psi )