LOCTITE ABLESTIK 84-3J

LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.

• Electrically Insulating
• Engineered for accurate bondline control
• One component
• Long work life

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	41.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	112.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	10.0 ppm
Extractable Ionic Content, Potassium (K+)	20.0 ppm
Extractable Ionic Content, Sodium (Na+)	5.0 ppm
Glass Transition Temperature (Tg)	87.0 °C
RT Die Shear Strength	21.0 kg-f
Tensile Modulus, @ 250.0 °C	172.0 N/mm² (25000.0 psi )
Thermal Conductivity	0.5 W/mK
Thixotropic Index	2.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	20000.0 mPa·s (cP)