LOCTITE ECCOBOND FP4530SF

LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill LOCTITE® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. LOCTITE ECCOBOND FP4530SF is the silane-free version of LOCTITE ECCOBOND FP4530.

• Snap curable
• Compatible with small gap sizes
• Fast flow

Applications	Underfilling
Coefficient of Thermal Expansion (CTE), Above Tg	150.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	45.0 ppm/°C
Color	Blue
Cure Schedule, @ 160.0 °C	8.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	145.0 °C
Pot Life	24.0 hr.
Storage Temperature	-40.0 °C
Technology	Epoxy
Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 20 rpm	3300.0 mPa·s (cP)