LOCTITE ECCOBOND UF 3912

LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications.

• Snap curable
• One component
• Halogen free
• Fast flow

Applications	Encapsulating, Underfilling
Coefficient of Thermal Expansion (CTE), Above Tg	105.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	28.0 ppm/°C
Color	Black
Cure Schedule, @ 160.0 °C	7.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	127.0 °C
Storage Modulus, DMA @ 25.0 °C	8100.0 N/mm²
Storage Temperature	-40.0 °C
Technology	Epoxy
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm	3500.0 mPa·s (cP)